Molded Interconnect Devices

MID = Molded Interconnect Devices
 
This term includes the production method and the function of the part. If the printed circuit carrier is 3-dimensional designed one is talking about the so-called 3D-MID, i. e. of ‘spatially injection molded printed circuit carriers'.


MID Applications

What are the reasons for applying MID?

Design possibilities:

  • Miniaturization
  • New functions
  • Multiple shapes possible

Ratio potential:

  • Less part counts
  • Shorter process chains
  • Reduced use of material
  • Higher reliability
  • Reduced supplier variety
  • Cost reduction
  • Reduced mounting and logistics
  • Reduced initial release costs

Environmental characteristics:

  • Reduced material variety
  • Reduced use of material
  • Material recycling





MID-Arguments

What are the reasons for applying MID?


 
Free Design Possibilities:
  • Integration of electronics and mechanics in one component
  • Miniaturization
  • New functions
  • Multiple shapes possible

Ratio Potential: 
  • Less part counts
  • Shorter process chains
  • Reduced use of material
  • Higher reliability
  • Reduced supplier variety
  • Cost reduction
  • Reduced mounting and logistics
  • Reduced initial release costs

 Environmental characteristics:
  • Reduced material variety
  • Reduced material consumption
  • Material-Recycling