Molded Interconnect Devices

MID = Molded Interconnect Devices
 

This term includes the production method and the function of the part. If the printed circuit carrier is 3-dimensional designed one is talking about the so-called 3D-MID, i. e. of ‘spatially injection molded printed circuit carriers'.


MID Applications

What are the reasons for applying MID?

Design possibilities:

• Miniaturization
• New functions
• Multiple shapes possible

Ratio potential:

• Less part counts
• Shorter process chains
• Reduced use of material
• Higher reliability
• Reduced supplier variety
• Cost reduction
• Reduced mounting and logistics
• Reduced initial release costs

Environmental characteristics:

• Reduced material variety
• Reduced use of material
• Material recycling

• Integration of electronics and mechanics in one component
• Miniaturization
• New functions
• Multiple shapes possible

Ratio Potential: 

• Less part counts
• Shorter process chains
• Reduced use of material
• Higher reliability
• Reduced supplier variety
• Cost reduction
• Reduced mounting and logistics
• Reduced initial release costs

 Environmental characteristics:

• Reduced material variety
• Reduced material consumption
• Material-Recycling